Wagno Alves Bragança Júnior (born in Belo Horizonte, Brazil, 1990) received his BEng in Electrical Engineering with emphasis in Microelectronics from the Federal University of Minas Gerais, Belo Horizonte, Brazil, in 2016. He received his MSEng in Advanced Device Technology from the Korean National University of Science and Technology, Daejeon, South Korea, in 2018. He worked as a research assistant at the Electronics and Telecommunications Research Institute, Daejeon, South Korea, from 2016 to 2018, where he researched and developed through-silicon via (TSV) integration processes (thermos-compression and laser-assisted bonding) with non-conductive paste (NCP).

From 2018 to 2023 he worked as a senior R&D engineer at JCET STATS ChipPAC Korea, where he developed laser-assisted bonding (LAB) processes for a variety of packages including fcBGA, fcSCP, SiP. WLP, and MCM. His contributions helped solidity the LAB process as a viable, reliable, and scalable bonding technology.

In 2024, Wagno joined the QuTech research group at TU Delft as a PhD candidate, where he researches and develops 3D integrated circuits for quantum computers. He aims to develop an active interposer for heterogenous integration using TSV. Wagno possesses an extensive experience in Quality Management Tools, Statistical Process Control, and Data Analysis. He has authored seven peer-reviewed academic papers and holds five US patents.

Wagno has been playing competitive Table Tennis for many years, but he also enjoys throwing frisbee, playing pool, and swimming. Occasionally he is found dancing Salsa and Bachata, or trying out bouldering at the local gym.